View BU52012NVX_4724805.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. hall ics unipolar detection hall ics bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv description the unipolar detection hall ic detects only either the n pole or s pole. the output turns on (active low) upon detection. features 1) unipolar detection 2) micropower operation (small current using intermittent operation method) 3) ultra-compact csp4 package (bu52002gul, bu52003gul) 4) ultra- small outline package (BU52012NVX) 5) small outline package (bu52012hfv, bu52013hfv) 6) line up of supply voltage for 1.8v power supply voltage (BU52012NVX, bu52012hfv, bu52013hfv) for 3.0v power supply voltage (bu52002gul, bu52003gul) 7) high esd resistance 8kv(hbm) applications mobile phones, notebook computers, digital video camera, digital still camera, etc. lineup matrix function product name supply voltage (v) operate point (mt) hysteresis (mt) period (ms) supply current (avg.) (a) output type package s pole bu52002gul 2.40 3.30 3.7 0.8 50 6.5 cmos vcsp50l1 BU52012NVX 1.65 3.60 3.0 0.9 50 3.5 coms sson004x1216 bu52012hfv 1.65 3.30 3.0 0.9 50 3.5 cmos hvsof5 n pole bu52003gul 2.40 3.30 -3.7 0.8 50 6.5 cmos vcsp50l1 bu52013hfv 1.65 3.30 -3.0 0.9 50 3.5 cmos hvsof5 plus is expressed on the s-pole; minus on the n-pole no.10045ect03
bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 2/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. absolute maximum ratings bu52002gul,bu52003gul (ta=25 ) BU52012NVX (ta=25 ) parameter symbol ratings unit parameter symbol ratings unit power supply voltage v dd -0.1 +4.5 1 v power supply voltage v dd -0.1 +4.5 3 v output current i out 1 ma output current i out 0.5 ma power dissipation pd 420 2 mw power dissipation pd 2049 4 mw operating temperature range t opr -40 +85 operating temperature range t opr -40 +85 storage temperature range t stg -40 +125 storage temperature range t stg -40 +125 1. not to exceed pd 2. reduced by 4.20mw for each increase in ta of 1 over 25 (mounted on 50mm 58mm glass-epoxy pcb) 3. not to exceed pd 4. reduced by 5.36mw for each increase in ta of 1 over 25 (mounted on 70mm 70mm 1.6mm glass-epoxy pcb) bu52012hfv,bu52013hfv (ta=25 ) parameter symbol ratings unit power supply voltage v dd -0.1 +4.5 5 v output current i out 0.5 ma power dissipation pd 536 6 mw operating temperature range t opr -40 +85 storage temperature range t stg -40 +125 5. not to exceed pd 6. reduced by 5.36mw for each increase in ta of 1 over 25 (mounted on 70mm 70mm 1.6mm glass-epoxy pcb) magnetic, electrical characteristics bu52002gul (unless otherwise specified, v dd =3.0v, ta=25 ) parameter symbol limits unit conditions min. typ. max. power supply voltage v dd 2.4 3.0 3.3 v operate point b ops - 3.7 5.5 mt release point b rps 0.8 2.9 - mt hysteresis b hyss - 0.8 - mt period t p - 50 100 ms output high voltage v oh v dd -0.4 - - v b bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 3/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. bu52003gul (unless otherwise specified, v dd =3.0v, ta=25 ) parameter symbol limits unit conditions min. typ. max. power supply voltage v dd 2.4 3.0 3.3 v operate point b opn -5.5 -3.7 - mt release point b rpn - -2.9 -0.8 mt hysteresis b hysn - 0.8 - mt period t p - 50 100 ms output high voltage v oh v dd -0.4 - - v b rpn bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 4/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. BU52012NVX (unless otherwise specified, v dd =1.80v, ta=25 ) parameter symbol limits unit conditions min. typ. max. power supply voltage v dd 1.65 1.80 3.60 v operate point b ops - 3.0 5.0 mt release point b rps 0.6 2.1 - mt hysteresis b hyss - 0.9 - mt period t p - 50 100 ms output high voltage v oh v dd -0.2 - - v b bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 5/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. bu52012hfv (unless otherwise specified, v dd =1.80v, ta=25 ) parameter symbol limits unit conditions min. typ. max. power supply voltage v dd 1.65 1.80 3.30 v operate point b ops - 3.0 5.0 mt release point b rps 0.6 2.1 - mt hysteresis b hyss - 0.9 - mt period t p - 50 100 ms output high voltage v oh v dd -0.2 - - v b bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 6/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. bu52013hfv (unless otherwise specified, v dd =1.80v, ta=25 ) parameter symbol limits unit conditions min. typ. max. power supply voltage v dd 1.65 1.80 3.30 v operate point b opn -5.0 -3.0 - mt release point b rpn - -2.1 -0.6 mt hysteresis b hysn - 0.9 - mt period t p - 50 100 ms output high voltage v oh v dd -0.2 - - v b rpn bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 7/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. figure of measurement circuit product name i out bu52002gul, bu52003gul 1.0ma BU52012NVX, bu52012hfv, bu52013hfv 0.5ma product name i out bu52002gul, bu52003gul 1.0ma BU52012NVX, bu52012hfv, bu52013hfv 0.5ma fig.3 v oh measurement circuit fig.5 i dd measurement circuit v oh vdd vdd gnd out 100f v i out fig.4 v ol measurement circuit v ol vdd vdd gnd out 100f v i out i dd vdd vdd gnd out 2200f a bop and brp are measured with applying the magnetic field from the outside. fig.1 b op ,b rp measurement circuit fig.2 t p measurement circuit b op /b rp vdd vdd gnd out 100f v t p 200 vdd vdd gnd out oscilloscope the period is monitored by oscilloscope.
bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 8/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. technical (reference) data bu52002gul (v dd =2.4 3.3v type) bu52003gul (v dd =2.4 3.3v type) fig.9 t p ? supply voltage fig.6 bop,brp ? ambient temperature fig.10 i dd ? ambient temperature fig.8 t p ?ambient temperature fig.7 bop,brp ? supply voltage fig.11 i dd ? supply voltage 0 10 20 30 40 50 60 70 80 90 100 -60 -40 -20 0 20 40 60 80 100 ambient temperature [ ] period [ms] v dd =3.0v 0 10 20 30 40 50 60 70 80 90 100 2.0 2.4 2.8 3.2 3.6 supply voltage [v] period [ms] ta = 25c -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 -60 - 40 -20 0 20 40 60 80 100 ambient temperature [ ] magnetic flux density [mt] bop s brp s v dd =3.0v -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 2.0 2.4 2.8 3.2 3.6 supply voltage v magnetic flux density [mt] ta = 25c bop s brp s 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -60 -40 -20 0 20 40 60 80 100 ambient temperature [ ] average supply current [a] v dd =3.0v 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 2.0 2.4 2.8 3.2 3.6 supply voltage [v] average supply current [a] ta = 25c fig.12 bop,brp ? ambient temperature fig.13 bop,brp ? supply voltage fig.16 i dd ? ambient temperature fig.17 i dd ? supply voltage fig.14 t p ? ambient temperature fig.15 t p ?supply voltage 0 10 20 30 40 50 60 70 80 90 100 - 60 - 40 - 20 0 20 40 60 80 100 ambient temperature [ ] period [ms] v dd =3.0v 0 10 20 30 40 50 60 70 80 90 100 2.0 2.4 2.8 3.2 3.6 supply voltage [v] period [ms] ta = 25c 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -60 - 40 - 20 0 20 40 60 80 100 ambient temperature [ ] average supply current [a] v dd =3.0v 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 2.0 2.4 2.8 3.2 3.6 supply voltage [v] average supply current [a] ta = 25c brp n bop n -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 2.0 2.4 2.8 3.2 3.6 supply voltage v magnetic flux density [mt] ta = 25c -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 -60 - 40 -20 0 20 40 60 80 100 ambient temperature [ ] magnetic flux density [mt] v dd =3.0v brp n bop n
bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 9/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. BU52012NVX (v dd =1.65 3.6v type) bu52012hfv (v dd =1.65 3.3v type) -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage v magnetic flux density [mt] ta = 25c bop s brp s 0 10 20 30 40 50 60 70 80 90 100 - 60 - 40 - 20 0 20 40 60 80 100 ambient temperature [ ] period [ms] v dd =1.8v -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 - 60 - 40 - 20 0 20 40 60 80 100 ambient temperature [ ] magnetic flux density [mt] v dd =1.8v bop s brp s 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -60 - 40 - 20 0 20 40 60 80 100 ambient temperature [ ] average supply current [a] v dd =1.8v fig.18 bop,brp ? ambient temperature fig.19 bop,brp ? supply voltage fig.22 i dd ? ambient temperature fig.23 i dd ? supply voltage fig.20 t p ? ambient temperature fig.21 t p ? supply voltage 0 10 20 30 40 50 60 70 80 90 100 1.41.82.22.63.03.43.8 supply voltage [v] period [ms] ta = 25c 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage [v] average supply current [a] ta = 25c fig.24 bop,brp ? ambient temperature fig.25 bop,brp ? supply voltage fig.28 i dd ? ambient temperature fig.29 i dd ? supply voltage fig.26 t p ? ambient temperature fig.27 t p ? supply voltage 0 10 20 30 40 50 60 70 80 90 100 - 60 - 40 - 20 0 20 40 60 80 100 ambient temperature [ ] period [ms] v dd =1.8v 0 10 20 30 40 50 60 70 80 90 100 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage [v] period [ms] ta = 25c -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 - 60 - 40 - 20 0 20 40 60 80 100 ambient temperature [ ] magnetic flux density [mt] v dd =1.8v bop s brp s -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage v magnetic flux density [mt] ta = 25c bop s brp s 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -60 - 40 - 20 0 20 40 60 80 100 ambient temperature [ ] average supply current [a] v dd =1.8v 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage [v] average supply current [a] ta = 25c
bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 10/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. bu52013hfv (v dd =1.65 3.3v type) 0 10 20 30 40 50 60 70 80 90 100 1.41.82.22.63.03.43.8 supply voltage [v] period [ms] ta = 25c 0 10 20 30 40 50 60 70 80 90 100 -60 -40 -20 0 20 40 60 80 100 ambient temperature [ ] period [ms] v dd =1.8v -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 - 60 - 40 - 20 0 20 40 60 80 100 ambient temperature [ ] magnetic flux density [mt] v dd =1.8v brp n bop n -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage v magnetic flux density [mt] ta = 25c brp n bop n 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -60 - 40 - 20 0 20 40 60 80 100 ambient temperature [ ] average supply current [a] v dd =1.8v 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage [v] average supply current [a] ta = 25c fig.30 bop,brp ? ambient temperature fig.31 bop,brp ? supply voltage fig.34 i dd ? ambient temperature fig.35 i dd ? supply voltage fig.33 t p ? supply voltage fig.32 t p ? ambient temperature
bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 11/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. block diagram bu52002gul, bu52003gul pin no. pin name function comment a1 vdd power supply a2 gnd ground b1 out output b2 n.c. open or short to gnd. BU52012NVX pin no. pin name function comment 1 out output 2 gnd ground 3 n.c. open or short to gnd. 4 vdd power supply fig.36 out gnd vdd latch timing logic dynamic offset cancellation sample & hold hall element a2 b1 a1 0.1f a1 b2 b1 a2 reverse a2 b2 b1 a1 surface the cmos output terminals enable direct connection to the pc, with no external pull-up resistor required. adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. reverse surface 1 2 4 3 3 4 2 1 2 fig.37 out gnd vdd latch timing logic dynamic offset cancellation sample & hold hall element 1 4 0.1f the cmos output terminals enable direct connection to the pc, with no external pull-up resistor required. adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc.
bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 12/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. bu52012hfv, bu52013hfv pin no. pin name function comment 1 n.c. open or short to gnd. 2 gnd ground 3 n.c. open or short to gnd. 4 vdd power supply 5 out output description of operations (micropower operation) (offset cancelation) the unipolar detection hall ic adopts an intermittent operation method to save energy. at star tup, the hall elements, amp, comparator and other detection circuit power on and magnetic detection begins. during standby, the detection circuits power off, thereby reducing current consumption. the detection results are held while standby is active, and then output. reference period: 50ms (max100ms) reference startup time: 24s fig.39 the hall elements form an equivalent wheatstone (resistor) bridge circuit. offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. a dynamic offset cancellation circuit is employed to cancel this offset voltage. when hall elements are connected as shown in fig. 40 and a magnetic field is applied perpendicular to the hall elements, voltage is generated at the mid-po int terminal of the bridge. this is known as hall voltage. dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90 ? angle from its original path, and thereby cancels the hall voltage. the magnetic signal (only) is maintained in the sample/hold circuit during the offset cancellation process and then released. gnd v dd i b hall voltage fig.40 reverse 1 2 5 3 3 surface 1 4 5 2 4 fig.38 out gnd vdd latch timing logic dynamic offset cancellation sample & hold hall element 2 5 4 0.1f the cmos output terminals enable direct connection to the pc, with no external pull-up resistor required. adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. i dd standby startup time period t
bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 13/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. (magnetic field detection mechanism) the hall ic cannot detect magnetic fields that run horizontal to the package top layer. be certain to configure the hall ic so that the m agnetic field is perpendicular to the top layer. fig.41 s n s n flux flux s s n
bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 14/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. bu52002gul,bu52012hfv fig.42 s-pole detection bu52002gul, bu52012hfv detects and outputs for the s-pole only. since it is unipolar, it does not recognize the n-pole. bu52003gul, bu52013hfv fig.43 n-pole detection bu52003gul, bu52013hfv detects and outputs for the n-pole only. since it is unipolar, it does not recognize the s-pole. the unipolar detection hall ic detects magnetic fields running perpendicular to the top surfac e of the package. there is an inverse relationship between magnetic flux density and the di stance separating the magnet and the hall ic: when distance increases magnetic density falls. when it drops below the operate point (bop), output goes high. when the magnet gets closer to the ic and magnetic density ri ses, to the operate point, the output switches low. in low output mode, the distance from the magnet to the ic increases again until the magnetic density falls to a point just below bop, and output returns high. (this point, where magnetic flux density restor es high output, is known as the release point, brp.) this detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation. n-pole b bop n brp n 0 high n-pole magnetic flux density [mt] flux high high low out [v] n n s s s n s-pole flux s-pole flux b low brp s bop s 0 high n-pole magnetic flux density [mt] flux high high out [v] n n s s s n s-pole
bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 15/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. intermittent operation at power on the unipolar detection hall ic adopts an intermittent operation method in detecting the magnetic field during startup, as shown in fig.44. it outputs to the appropriate terminal based on the detection result and maintains the output condition during the standby period. the time from power on until the end of the in itial startup period is an indefinite interval, but it cannot exceed the maximum period, 10 0ms. to accommodate the system desig n, the hall ic output read should be programmed within 100ms of power on, but after the time allo wed for the period ambient temperature and supply voltage. magnet selection of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume than ferrite, thereby enabling the highest degree of miniaturization, thus, neodymium is best suited for small equipment applications. fig.45 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. the graph plots the correlation between the distance (l) from th ree versions of a 4mm x 4mm cross-section neodymium magnet (1mm, 2mm, and 3mm thick) and magnetic flux density. fig.46 shows hall ic detection distance ? a good guide for determining the proper size and detection distance of the magnet. based on the bu52012hfv, bu52013hfv operating point max 5.0 mt, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm, respectively. to increase the magnet?s detection distance, either increase its thickness or sectional area. power on vdd startup time standby time standby time startup time (intermittentaction) indefinite interval out (no magnetic field present) indefinite interval out (magnetic field present) low high supply current fig.44 x=y=4mm t=1mm,2mm,3mm x t y flux density measuring point l: variable t fig.46 magnet dimensions and flux density measuring point magnet size magnet magnet material: neomax-44h (material) maker: neomax co.,ltd. 0 1 2 3 4 5 6 7 8 9 10 02468101214161820 distance between magnet and hall ic [mm] magnetic flux density[mt] fig.45 7.6mm t=3mm t=1mm t=2mm 9.2mm 10.4mm
bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 16/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. position of the hall effect ic(reference) footprint dimensions (optimize footprint dimensi ons to the board design and soldering condition) vcsp50l1 sson004x1216 hvsof5 (unit: mm) (unit: mm) sson004x1216 vcsp50l1 hvsof5 0.55 0.6 0.8 0.2 0.55 0.35 0.6 0.8 0.2 please avoid having potential overstress from pcb material, strength, mounting positions. if you had any further questions or concerns, please contact your rohm sales and affiliate.
bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 17/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. operation notes 1) absolute maximum ratings exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or destruction of the ic. because the source (short mode or open mode) cannot be identified if the device is damaged in this way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in excess of absolute rating limits. 2) gnd voltage make sure that the gnd terminal potential is maintained at the minimum in any operating state, and is always kept lower than the potential of all other pins. 3) thermal design use a thermal design that allows for sufficient margin in light of the power dissipation (pd) in actual operating conditions. 4) pin shorts and mounting errors use caution when positioning the ic for mounting on printed ci rcuit boards. mounting errors, such as improper positioning or orientation, may damage or destroy the device. the ic may also be damaged or destroyed if output pins are shorted together, or if shorts occur between t he output pin and supply pin or gnd. 5) positioning components in proximity to the hall ic and magnet positioning magnetic components in close proximity to the hall ic or magnet may alter the ma gnetic field, and therefore the magnetic detection operation. thus, placing magnetic components near the hall ic and magnet should be avoided in the design if possible. however, where t here is no alternative to employing such a design, be sure to thoroughly test and evaluate performance with the magnetic co mponent(s) in place to verify normal operation before implem enting the design. 6) operation in strong electromagnetic fields exercise extreme caution about using the device in the presence of a strong electr omagnetic field, as such use may cause the ic to malfunction. 7) common impedance make sure that the power supply and gnd wiring limits co mmon impedance to the extent possible by, for example, employing short, thick supply and ground lines. also, take measures to minimize ripple such as using an inductor or capacitor. 8) gnd wiring pattern when both a small-signal gnd and high-current gnd are provided, single-point grounding at t he reference point of the set pcb is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes due to the wiring resistance and high current do not cause any vo ltage fluctuation in the sma ll-signal gnd. in the same way, care must also be taken to avoid wiring pattern fluct uations in the gnd wiring pattern of external components. 9) exposure to strong light exposure to halogen lamps, uv and other str ong light sources may cause the ic to malf unction. if the ic is subject to such exposure, provide a shield or take other measures to protect it from the light. in testing, exposure to white led and fluorescent light sources was shown to have no significant effect on the ic. 10) power source design since the ic performs intermittent operation, it has peak cu rrent when it?s on. please taking that into account and under examine adequate evaluations when designing the power source.
bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 18/19 www. r ohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. ordering part number b u 5 2 0 0 2 g u l - e 2 part no. part no. 52002,52003, 52012,52013 package gul : vscp50l1 hfv : hvsof5 nvx: sson004x1216 packaging and forming specification e2: embossed tape and reel (vscp50l1) tr: embossed tape and reel (hvsof5, sson004x1216) direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin (unit : mm) hvsof5 s 0.08 m 0.1 s 4 321 5 (0.05) 1.60.05 1.00.05 1.60.05 1.2 0.05 (max 1.28 include burr) 45 32 1 (0.8) (0.91) (0.3) (0.41) 0.2max 0.130.05 0.220.05 0.6max 0.5 0.02 +0.03 ?0.02 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin (unit : mm) vcsp50l1 (bu52002gul) s 0.08 s a b ba 0.05 1pin mark 0.300.1 4- 0.250.05 1.100.1 2 1 0.300.1 b 0.55max 1.100.1 a 0.100.05 0.50 0.50 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin (unit : mm) vcsp50l1 (bu52003gul) s 0.08 s a b ba 0.05 1pin mark 0.300.1 4- 0.250.05 1.100.1 2 1 0.300.1 b 0.55max 1.100.1 a 0.100.05 0.50 0.50
bu52002gul,bu52003g ul,BU52012NVX,bu52 012hfv,bu52013hfv technical note 19/19 www.rohm.com 2010.08 - rev.c ? 2010 rohm co., ltd. all rights reserved. (unit : mm) sson004x1216 s 0.08 s 3 4 21 1pin mark 1.2 0.1 0.65 0.1 0.75 0.1 1.6 0.1 0.2 0.1 0.8 0.1 0.6max (0.12) 0.02 +0.03 - 0.02 0.2 +0.05 - 0.04 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 5000pcs tr () direction of feed reel 1pin
r1010 a www.rohm.com ? 2010 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redunda ncy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospac e machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.

▲Up To Search▲

Price & Availability of BU52012NVX

	To Download BU52012NVX Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .